Properties of phenolic-based Ag-filled conductive adhesive affected by different coupling agents

Properties of phenolic-based Ag-filled conductive adhesive affected by different coupling agents

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Bibliographic Details
Main Authors: Ho, Li Ngee, Dr., Teng, Fei Wu, Hiroshi, Nishikawa
Other Authors: holingee@yahoo.com
Format: Article
Language:English
Published: Taylor and Francis Group, LLC. 2014
Subjects:
Conductive adhesives
Coupling agents
Electrical resistivity
Rheology
Shear strength
Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/33189
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Institution: Universiti Malaysia Perlis
Language: English

Internet

http://dspace.unimap.edu.my:80/dspace/handle/123456789/33189

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