Interaction relationship analysis of surface roughness on aluminium etched wafer using RIE

Interaction relationship analysis of surface roughness on aluminium etched wafer using RIE

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Bibliographic Details
Main Authors: Zaliman, Sauli, Dr., Retnasamy, Vithyacharan, Aaron, Koay Terr Yeow, Wei Wei, Ng
Other Authors: vc.sundres@gmail.com
Format: Article
Language:English
Published: Trans Tech Publications 2014
Subjects:
Aluminum
Design of experiment (DOE)
Reactive Ion Etching (RIE)
Surface roughness
Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/33660
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Institution: Universiti Malaysia Perlis
Language: English
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Summary:Link to publisher's homepage at http://www.ttp.net/

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