CuDia slug size variation analysis on heat dissipation of high power LED
Link to publisher's homepage at http://www.ttp.net/
Saved in:
Main Authors: | , , |
---|---|
Other Authors: | |
Format: | Article |
Language: | English |
Published: |
Trans Tech Publications
2014
|
Subjects: | |
Online Access: | http://dspace.unimap.edu.my:80/dspace/handle/123456789/33665 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | Universiti Malaysia Perlis |
Language: | English |
id |
my.unimap-33665 |
---|---|
record_format |
dspace |
spelling |
my.unimap-336652014-04-13T08:03:29Z CuDia slug size variation analysis on heat dissipation of high power LED Vairavan, Rajendaran Retnasamy, Vithyacharan Zaliman, Sauli, Dr. vc.sundress@gmail.com Ansys CuDia heat slug High power LED Junction temperature Link to publisher's homepage at http://www.ttp.net/ The current advancement of LED has prompt thermal challenges from the packaging point of view. The reliability of the LED is significantly influenced by each of its packaging component. This paper presents the investigation of heat slug size effect on the junction temperature and stress of single chip LED through simulation method. Ansys version 11 was utilized and the analysis was done with copper diamond rectangular heat slug under natural convection condition at ambient temperature of 25 °C.The simulation results indicated that junction temperature and the stress of the single chip LED is influenced by the size of heat slug. 2014-04-13T08:03:29Z 2014-04-13T08:03:29Z 2014-01 Article Applied Mechanics and Materials, vol.487, 2014, pages 33-36 1662-7482 http://dspace.unimap.edu.my:80/dspace/handle/123456789/33665 http://www.scientific.net/AMM.487.33 10.4028/www.scientific.net/AMM.487.33 en Trans Tech Publications |
institution |
Universiti Malaysia Perlis |
building |
UniMAP Library |
collection |
Institutional Repository |
continent |
Asia |
country |
Malaysia |
content_provider |
Universiti Malaysia Perlis |
content_source |
UniMAP Library Digital Repository |
url_provider |
http://dspace.unimap.edu.my/ |
language |
English |
topic |
Ansys CuDia heat slug High power LED Junction temperature |
spellingShingle |
Ansys CuDia heat slug High power LED Junction temperature Vairavan, Rajendaran Retnasamy, Vithyacharan Zaliman, Sauli, Dr. CuDia slug size variation analysis on heat dissipation of high power LED |
description |
Link to publisher's homepage at http://www.ttp.net/ |
author2 |
vc.sundress@gmail.com |
author_facet |
vc.sundress@gmail.com Vairavan, Rajendaran Retnasamy, Vithyacharan Zaliman, Sauli, Dr. |
format |
Article |
author |
Vairavan, Rajendaran Retnasamy, Vithyacharan Zaliman, Sauli, Dr. |
author_sort |
Vairavan, Rajendaran |
title |
CuDia slug size variation analysis on heat dissipation of high power LED |
title_short |
CuDia slug size variation analysis on heat dissipation of high power LED |
title_full |
CuDia slug size variation analysis on heat dissipation of high power LED |
title_fullStr |
CuDia slug size variation analysis on heat dissipation of high power LED |
title_full_unstemmed |
CuDia slug size variation analysis on heat dissipation of high power LED |
title_sort |
cudia slug size variation analysis on heat dissipation of high power led |
publisher |
Trans Tech Publications |
publishDate |
2014 |
url |
http://dspace.unimap.edu.my:80/dspace/handle/123456789/33665 |
_version_ |
1643797246048731136 |