Test chip and substrate design for flip chip microelectronic package thermal measurements
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Emerald Group Publishing Limited
2014
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my.unimap-339432014-04-23T04:38:24Z Test chip and substrate design for flip chip microelectronic package thermal measurements Goh, Teck Joo Chiu, Chiapin Seetharamu, Kankanhally N. Ghulam, Abdul Quadir, Prof. Dr. Zainal Alimuddin, Zainal Alauddin, Dr. teck.joo.goh@intel.com knseetharamu@hotmail.com gaquadir@unimap.edu.my Finite element analysis Printed circuits Tests and testing Thermal testing Link to publisher's homepage at http://www.emeraldinsight.com/ Purpose: This paper's purpose is to review the design of a flip chip thermal test vehicle. Design/methodology/approach: Design requirements for different applications such as thermal characterization, assembly process optimization, and product burn-in simulation are outlined and the design processes of different thermal test chip structures including the temperature sensor and passive heaters are described in detail. The design of fireball heater, a novel test chip structure used for evaluating the effectiveness of heat spreading of advanced thermal solutions, is also explained. Findings: Describes the design considerations and processes of the package substrate and printed-circuit board with special emphasis on the physical routing of the thermal test chip structures. These design processes are supported with thermal data from various finite-element analyses carried out to evaluate the capability and limitations of thermal test vehicle design. Originality/value: The validation and calibration procedures of a thermal test vehicle are presented in this paper. 2014-04-23T04:38:24Z 2014-04-23T04:38:24Z 2006 Article Microelectronics International, vol. 23(2), 2006, pages 3-10 1356-5362 http://dspace.unimap.edu.my:80/dspace/handle/123456789/33943 http://dx.doi.org/10.1108/13565360610669959 http://www.emeraldinsight.com/journals.htm?articleid=1550663 en Emerald Group Publishing Limited |
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Malaysia |
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Universiti Malaysia Perlis |
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| language |
English |
| topic |
Finite element analysis Printed circuits Tests and testing Thermal testing |
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Finite element analysis Printed circuits Tests and testing Thermal testing Goh, Teck Joo Chiu, Chiapin Seetharamu, Kankanhally N. Ghulam, Abdul Quadir, Prof. Dr. Zainal Alimuddin, Zainal Alauddin, Dr. Test chip and substrate design for flip chip microelectronic package thermal measurements |
| description |
Link to publisher's homepage at http://www.emeraldinsight.com/ |
| author2 |
teck.joo.goh@intel.com |
| author_facet |
teck.joo.goh@intel.com Goh, Teck Joo Chiu, Chiapin Seetharamu, Kankanhally N. Ghulam, Abdul Quadir, Prof. Dr. Zainal Alimuddin, Zainal Alauddin, Dr. |
| format |
Article |
| author |
Goh, Teck Joo Chiu, Chiapin Seetharamu, Kankanhally N. Ghulam, Abdul Quadir, Prof. Dr. Zainal Alimuddin, Zainal Alauddin, Dr. |
| author_sort |
Goh, Teck Joo |
| title |
Test chip and substrate design for flip chip microelectronic package thermal measurements |
| title_short |
Test chip and substrate design for flip chip microelectronic package thermal measurements |
| title_full |
Test chip and substrate design for flip chip microelectronic package thermal measurements |
| title_fullStr |
Test chip and substrate design for flip chip microelectronic package thermal measurements |
| title_full_unstemmed |
Test chip and substrate design for flip chip microelectronic package thermal measurements |
| title_sort |
test chip and substrate design for flip chip microelectronic package thermal measurements |
| publisher |
Emerald Group Publishing Limited |
| publishDate |
2014 |
| url |
http://dspace.unimap.edu.my:80/dspace/handle/123456789/33943 |
| _version_ |
1643797354222977024 |