Test chip and substrate design for flip chip microelectronic package thermal measurements

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Bibliographic Details
Main Authors:	Goh, Teck Joo, Chiu, Chiapin, Seetharamu, Kankanhally N., Ghulam, Abdul Quadir, Prof. Dr., Zainal Alimuddin, Zainal Alauddin, Dr.
Other Authors:	teck.joo.goh@intel.com
Format:	Article
Language:	English
Published:	Emerald Group Publishing Limited 2014
Subjects:	Finite element analysis Printed circuits Tests and testing Thermal testing
Online Access:	http://dspace.unimap.edu.my:80/dspace/handle/123456789/33943
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Institution:	Universiti Malaysia Perlis
Language:	English

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