Thermal management of multichipmodule (MCM) using genetic algorithms

Thermal management of multichipmodule (MCM) using genetic algorithms

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Main Authors: Jeevan, Kanesan, Seetharamu, Kankanhally N., Ishak, I.A., Ghulam, Abdul Quadir, Prof. Dr.
Other Authors: knseetharamu@hotmail.com
Format: Working Paper
Language:English
Published: IEEE Conference Publications 2014
Subjects:
Genetic algorithms
Thermal management
Energy dissipation
Boundary conditions
Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/33954
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Institution: Universiti Malaysia Perlis
Language: English
id my.unimap-33954
record_format dspace
spelling my.unimap-339542014-04-23T06:32:20Z Thermal management of multichipmodule (MCM) using genetic algorithms Jeevan, Kanesan Seetharamu, Kankanhally N. Ishak, I.A. Ghulam, Abdul Quadir, Prof. Dr. knseetharamu@hotmail.com gaquadir@unimap.edu.my Genetic algorithms Thermal management Energy dissipation Boundary conditions Link to publisher's homepage at http://ieeexplore.ieee.org/ The placement of power dissipating chips for a multichip module (MCM) is carried out using genetic algorithms. Since high power is to be dissipated over a small area of a module, the heat must be conducted away efficiently. The main design issue is to achieve uniform thermal distribution. The placement of uniform power dissipating chips is tested using an odd and even number of placement locations. Then the chips with non-uniform power are placed and the results obtained compare well with the force-directed method and quadrisection method. 2014-04-23T06:32:20Z 2014-04-23T06:32:20Z 2003 Working Paper IEEE Region 10 Annual International Conference, Proceedings, vol. 1, 2003, pages 474-478 0-7803-8162-9 http://dspace.unimap.edu.my:80/dspace/handle/123456789/33954 http://dx.doi.org/10.1109/TENCON.2003.1273367 http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=1273367&tag=1 en IEEE Conference Publications
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Genetic algorithms
Thermal management
Energy dissipation
Boundary conditions
spellingShingle Genetic algorithms
Thermal management
Energy dissipation
Boundary conditions
Jeevan, Kanesan
Seetharamu, Kankanhally N.
Ishak, I.A.
Ghulam, Abdul Quadir, Prof. Dr.
Thermal management of multichipmodule (MCM) using genetic algorithms
description Link to publisher's homepage at http://ieeexplore.ieee.org/
author2 knseetharamu@hotmail.com
author_facet knseetharamu@hotmail.com
Jeevan, Kanesan
Seetharamu, Kankanhally N.
Ishak, I.A.
Ghulam, Abdul Quadir, Prof. Dr.
format Working Paper
author Jeevan, Kanesan
Seetharamu, Kankanhally N.
Ishak, I.A.
Ghulam, Abdul Quadir, Prof. Dr.
author_sort Jeevan, Kanesan
title Thermal management of multichipmodule (MCM) using genetic algorithms
title_short Thermal management of multichipmodule (MCM) using genetic algorithms
title_full Thermal management of multichipmodule (MCM) using genetic algorithms
title_fullStr Thermal management of multichipmodule (MCM) using genetic algorithms
title_full_unstemmed Thermal management of multichipmodule (MCM) using genetic algorithms
title_sort thermal management of multichipmodule (mcm) using genetic algorithms
publisher IEEE Conference Publications
publishDate 2014
url http://dspace.unimap.edu.my:80/dspace/handle/123456789/33954
_version_ 1643797357854195712

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