A new invention of thermal pad using sol-gel nano-silver doped silica film in plastic leaded chip carrier (PLCC) application by using computational fluid dynamic sofrware, CFD analysis
Link to publisher's homepage at http://www.ttp.net/
Saved in:
| Main Authors: | , , , , , |
|---|---|
| Other Authors: | |
| Format: | Article |
| Language: | English |
| Published: |
Trans Tech Publications
2014
|
| Subjects: | |
| Online Access: | http://dspace.unimap.edu.my:80/dspace/handle/123456789/34339 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Institution: | Universiti Malaysia Perlis |
| Language: | English |
| id |
my.unimap-34339 |
|---|---|
| record_format |
dspace |
| spelling |
my.unimap-343392014-05-06T04:46:06Z A new invention of thermal pad using sol-gel nano-silver doped silica film in plastic leaded chip carrier (PLCC) application by using computational fluid dynamic sofrware, CFD analysis Mazlan, Mohamed A. Rahim Mohd Mustafa Al-Bakri, Abdullah Iqbal, M. A. Wan Yusra Hannanah, Wan Abdul Razak Mohammad Shahril, Salim mazlan547@ppinang.uitm.edu.my mustafa_albakri@unimap.edu.my mshahril@unimap.edu.my Nano-Silver Numerical simulation PLCC package Thermal pad Link to publisher's homepage at http://www.ttp.net/ Thermal pad is new technology in the world that been used in PLCC in order to reduce junction temperature to the minimum level in electronic components. Thermal Pad was made by using nano-silver as main material. Nano-silver silica films were applied on PLCC using a sol-gel process and heat-treated at different temperatures. In electronic industry, the electronic components that exceed 70°C will malfunction and damage due to the overheated. The design is used nano-silver as main material in thermo pad because it has high value of thermal conductivity and enables to dissipate heat very efficiently. The advantages of this product are enables to reduce junction temperature of PLCC 20-30%. It also had constant thickness in order to get accurate results. It was a new technology that been applied in electronic industry in order to reduce the temperature of the electronic components. 2014-05-06T04:46:06Z 2014-05-06T04:46:06Z 2013 Article Advanced Materials Research, vol. 795, 2013, pages 158-163 978-303785811-0 1022-6680 http://www.scientific.net/AMR.795.158 http://dspace.unimap.edu.my:80/dspace/handle/123456789/34339 en Trans Tech Publications |
| institution |
Universiti Malaysia Perlis |
| building |
UniMAP Library |
| collection |
Institutional Repository |
| continent |
Asia |
| country |
Malaysia |
| content_provider |
Universiti Malaysia Perlis |
| content_source |
UniMAP Library Digital Repository |
| url_provider |
http://dspace.unimap.edu.my/ |
| language |
English |
| topic |
Nano-Silver Numerical simulation PLCC package Thermal pad |
| spellingShingle |
Nano-Silver Numerical simulation PLCC package Thermal pad Mazlan, Mohamed A. Rahim Mohd Mustafa Al-Bakri, Abdullah Iqbal, M. A. Wan Yusra Hannanah, Wan Abdul Razak Mohammad Shahril, Salim A new invention of thermal pad using sol-gel nano-silver doped silica film in plastic leaded chip carrier (PLCC) application by using computational fluid dynamic sofrware, CFD analysis |
| description |
Link to publisher's homepage at http://www.ttp.net/ |
| author2 |
mazlan547@ppinang.uitm.edu.my |
| author_facet |
mazlan547@ppinang.uitm.edu.my Mazlan, Mohamed A. Rahim Mohd Mustafa Al-Bakri, Abdullah Iqbal, M. A. Wan Yusra Hannanah, Wan Abdul Razak Mohammad Shahril, Salim |
| format |
Article |
| author |
Mazlan, Mohamed A. Rahim Mohd Mustafa Al-Bakri, Abdullah Iqbal, M. A. Wan Yusra Hannanah, Wan Abdul Razak Mohammad Shahril, Salim |
| author_sort |
Mazlan, Mohamed |
| title |
A new invention of thermal pad using sol-gel nano-silver doped silica film in plastic leaded chip carrier (PLCC) application by using computational fluid dynamic sofrware, CFD analysis |
| title_short |
A new invention of thermal pad using sol-gel nano-silver doped silica film in plastic leaded chip carrier (PLCC) application by using computational fluid dynamic sofrware, CFD analysis |
| title_full |
A new invention of thermal pad using sol-gel nano-silver doped silica film in plastic leaded chip carrier (PLCC) application by using computational fluid dynamic sofrware, CFD analysis |
| title_fullStr |
A new invention of thermal pad using sol-gel nano-silver doped silica film in plastic leaded chip carrier (PLCC) application by using computational fluid dynamic sofrware, CFD analysis |
| title_full_unstemmed |
A new invention of thermal pad using sol-gel nano-silver doped silica film in plastic leaded chip carrier (PLCC) application by using computational fluid dynamic sofrware, CFD analysis |
| title_sort |
new invention of thermal pad using sol-gel nano-silver doped silica film in plastic leaded chip carrier (plcc) application by using computational fluid dynamic sofrware, cfd analysis |
| publisher |
Trans Tech Publications |
| publishDate |
2014 |
| url |
http://dspace.unimap.edu.my:80/dspace/handle/123456789/34339 |
| _version_ |
1643797451475255296 |