A new invention of thermal pad using sol-gel nano-silver doped silica film in plastic leaded chip carrier (PLCC) application by using computational fluid dynamic sofrware, CFD analysis

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Bibliographic Details
Main Authors:	Mazlan, Mohamed, A. Rahim, Mohd Mustafa Al-Bakri, Abdullah, Iqbal, M. A., Wan Yusra Hannanah, Wan Abdul Razak, Mohammad Shahril, Salim
Other Authors:	mazlan547@ppinang.uitm.edu.my
Format:	Article
Language:	English
Published:	Trans Tech Publications 2014
Subjects:	Nano-Silver Numerical simulation PLCC package Thermal pad
Online Access:	http://dspace.unimap.edu.my:80/dspace/handle/123456789/34339
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Institution:	Universiti Malaysia Perlis
Language:	English

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