Thermal management of electronic components by using computational fluid dynamic (CFD) software, fluent™ in several material applications (epoxy, composite material & nano-silver)

Thermal management of electronic components by using computational fluid dynamic (CFD) software, fluent™ in several material applications (epoxy, composite material & nano-silver)

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Bibliographic Details
Main Authors: Mazlan, Mohamed, A. Rahim, Mohd Mustafa Al-Bakri, Abdullah, Wan Yusra Hannanah, Wan Abdul Razak, Ahmad Faiz, Zubair, Y. M., Najib, A. Bakir, Azman
Other Authors: mazlan547@ppinang.uitm.edu.my
Format: Article
Language:English
Published: Trans Tech Publications 2014
Subjects:
Average junction temperature
Microprocessors
Nanomaterial
Thermal Management
Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/34343
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Institution: Universiti Malaysia Perlis
Language: English
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Summary:Link to publisher's homepage at http://www.ttp.net/

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