Thermal management of electronic components by using computational fluid dynamic (CFD) software, fluent™ in several material applications (epoxy, composite material & nano-silver)

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Main Authors:	Mazlan, Mohamed, A. Rahim, Mohd Mustafa Al-Bakri, Abdullah, Wan Yusra Hannanah, Wan Abdul Razak, Ahmad Faiz, Zubair, Y. M., Najib, A. Bakir, Azman
Other Authors:	mazlan547@ppinang.uitm.edu.my
Format:	Article
Language:	English
Published:	Trans Tech Publications 2014
Subjects:	Average junction temperature Microprocessors Nanomaterial Thermal Management
Online Access:	http://dspace.unimap.edu.my:80/dspace/handle/123456789/34343
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Institution:	Universiti Malaysia Perlis
Language:	English

id	my.unimap-34343
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spelling	my.unimap-343432014-05-06T05:20:18Z Thermal management of electronic components by using computational fluid dynamic (CFD) software, fluent™ in several material applications (epoxy, composite material & nano-silver) Mazlan, Mohamed A. Rahim Mohd Mustafa Al-Bakri, Abdullah Wan Yusra Hannanah, Wan Abdul Razak Ahmad Faiz, Zubair Y. M., Najib A. Bakir, Azman mazlan547@ppinang.uitm.edu.my mustafa_albakri@unimap.edu.my Average junction temperature Microprocessors Nanomaterial Thermal Management Link to publisher's homepage at http://www.ttp.net/ This paper presents the thermal management of electronic components, microprocessor by using three dimensional numerical analysis of heat and fluid flow in computer. 3D model of microprocessors is built using GAMBIT and simulated using FLUENT software. The study was made for four microprocessors arranged in line under different types of materials, inlet velocities and package (chip) powers. The results are presented in terms of averagejunction temperature and thermal resistance of each package Thejunction temperature is been observed and it was found that the junction temperature of the microprocessors is not exceed 70° C. It also found that the (chip) powers and inlet velocities are the most important elements to control and manage the junction temperature. The strength of CFD software in handling heat transfer problems is proved to be excellent 2014-05-06T05:20:18Z 2014-05-06T05:20:18Z 2013 Article Advanced Materials Research, vol. 795, 2013, pages 141-147 978-303785811-0 1022-6680 http://www.scientific.net/AMR.795.141 http://dspace.unimap.edu.my:80/dspace/handle/123456789/34343 en Trans Tech Publications
institution	Universiti Malaysia Perlis
building	UniMAP Library
collection	Institutional Repository
continent	Asia
country	Malaysia
content_provider	Universiti Malaysia Perlis
content_source	UniMAP Library Digital Repository
url_provider	http://dspace.unimap.edu.my/
language	English
topic	Average junction temperature Microprocessors Nanomaterial Thermal Management
spellingShingle	Average junction temperature Microprocessors Nanomaterial Thermal Management Mazlan, Mohamed A. Rahim Mohd Mustafa Al-Bakri, Abdullah Wan Yusra Hannanah, Wan Abdul Razak Ahmad Faiz, Zubair Y. M., Najib A. Bakir, Azman Thermal management of electronic components by using computational fluid dynamic (CFD) software, fluent™ in several material applications (epoxy, composite material & nano-silver)
description	Link to publisher's homepage at http://www.ttp.net/
author2	mazlan547@ppinang.uitm.edu.my
author_facet	mazlan547@ppinang.uitm.edu.my Mazlan, Mohamed A. Rahim Mohd Mustafa Al-Bakri, Abdullah Wan Yusra Hannanah, Wan Abdul Razak Ahmad Faiz, Zubair Y. M., Najib A. Bakir, Azman
format	Article
author	Mazlan, Mohamed A. Rahim Mohd Mustafa Al-Bakri, Abdullah Wan Yusra Hannanah, Wan Abdul Razak Ahmad Faiz, Zubair Y. M., Najib A. Bakir, Azman
author_sort	Mazlan, Mohamed
title	Thermal management of electronic components by using computational fluid dynamic (CFD) software, fluent™ in several material applications (epoxy, composite material & nano-silver)
title_short	Thermal management of electronic components by using computational fluid dynamic (CFD) software, fluent™ in several material applications (epoxy, composite material & nano-silver)
title_full	Thermal management of electronic components by using computational fluid dynamic (CFD) software, fluent™ in several material applications (epoxy, composite material & nano-silver)
title_fullStr	Thermal management of electronic components by using computational fluid dynamic (CFD) software, fluent™ in several material applications (epoxy, composite material & nano-silver)
title_full_unstemmed	Thermal management of electronic components by using computational fluid dynamic (CFD) software, fluent™ in several material applications (epoxy, composite material & nano-silver)
title_sort	thermal management of electronic components by using computational fluid dynamic (cfd) software, fluent™ in several material applications (epoxy, composite material & nano-silver)
publisher	Trans Tech Publications
publishDate	2014
url	http://dspace.unimap.edu.my:80/dspace/handle/123456789/34343
_version_	1643797452686360576

Thermal management of electronic components by using computational fluid dynamic (CFD) software, fluent™ in several material applications (epoxy, composite material & nano-silver)

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