Under Bump Metallurgy (UBM)-a technology review for flip chip packaging

Under Bump Metallurgy (UBM)-a technology review for flip chip packaging

Full text of this article is also available at http://mechanical.eng.um.edu.my/

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Bibliographic Details
Main Authors: Mohd Khairuddin Md Arshad, Uda Hashim, Muzamir Isa
Format: Article
Language:English
Published: Department of Mechanical Engineering, University Malaya 2008
Subjects:
Flip chip technology
Wafer bumping
Flip chip packaging
Online Access:http://dspace.unimap.edu.my/xmlui/handle/123456789/3506
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Institution: Universiti Malaysia Perlis
Language: English

Internet

http://dspace.unimap.edu.my/xmlui/handle/123456789/3506

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