Under Bump Metallurgy (UBM)-a technology review for flip chip packaging

Full text of this article is also available at http://mechanical.eng.um.edu.my/

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Bibliographic Details
Main Authors:	Mohd Khairuddin Md Arshad, Uda Hashim, Muzamir Isa
Format:	Article
Language:	English
Published:	Department of Mechanical Engineering, University Malaya 2008
Subjects:	Flip chip technology Wafer bumping Flip chip packaging
Online Access:	http://dspace.unimap.edu.my/xmlui/handle/123456789/3506
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Institution:	Universiti Malaysia Perlis
Language:	English

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Summary:	Full text of this article is also available at http://mechanical.eng.um.edu.my/

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