Hardened Glass Particle and Carbon Black using Resin for Potential Electromagnetic Shielding in Biomedical Electronic Equipments

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Main Authors: Cheng Ee, Meng, Mohd Shukry, Abdul Majid, Shahriman, Abu Bakar, Nashrul Fazli, Mohd Nasir, Khor Shing, Fhan, You Kok, Yeow, Lee Kim, Yee, Mohd Ridzuan, Mohd Jamir
Other Authors: emcheng@unimap.edu.my
Format: Article
Language:English
Published: IOP Publishing 2020
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Online Access:http://dspace.unimap.edu.my:80/xmlui/handle/123456789/69013
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Institution: Universiti Malaysia Perlis
Language: English
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spelling my.unimap-690132020-12-16T02:44:05Z Hardened Glass Particle and Carbon Black using Resin for Potential Electromagnetic Shielding in Biomedical Electronic Equipments Cheng Ee, Meng Mohd Shukry, Abdul Majid Shahriman, Abu Bakar Nashrul Fazli, Mohd Nasir Khor Shing, Fhan You Kok, Yeow Lee Kim, Yee Mohd Ridzuan, Mohd Jamir emcheng@unimap.edu.my Resin Electromagnetic properties Composites Link to publisher's homepage at https://iopscience.iop.org/ This study aims to investigate the electromagnetic properties of a composite of hardened glass particle and carbon using resin in determining the absorbability of the composite for electromagnetic interference (EMI). The electromagnetic absorption measurement was conducted using T-R method (transmission-reflection) by measuring the dielectric constant, loss factor, real and imaginary part of permeability, reflection coefficient and transmission coefficient. The measurement is taken for X band frequency and Ku band frequency within the frequency range from 8.2GHz to 12.4GHz and 12.4GHz to 18GHz, respectively. Dielectric constant of sample decrease when frequency increases. The high dielectric constant of material implies that the material has high absorbability of field energy, resulting in high attenuation of the applied field. 2020-12-16T02:44:05Z 2020-12-16T02:44:05Z 2019 Article Journal of Physics: Conference Series, vol.1372, 2019, 8 pages 1742-6588 (print) 1742-6596 (online) http://dspace.unimap.edu.my:80/xmlui/handle/123456789/69013 https://iopscience.iop.org/ en International Conference on Biomedical Engineering (ICoBE); IOP Publishing
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Resin
Electromagnetic properties
Composites
spellingShingle Resin
Electromagnetic properties
Composites
Cheng Ee, Meng
Mohd Shukry, Abdul Majid
Shahriman, Abu Bakar
Nashrul Fazli, Mohd Nasir
Khor Shing, Fhan
You Kok, Yeow
Lee Kim, Yee
Mohd Ridzuan, Mohd Jamir
Hardened Glass Particle and Carbon Black using Resin for Potential Electromagnetic Shielding in Biomedical Electronic Equipments
description Link to publisher's homepage at https://iopscience.iop.org/
author2 emcheng@unimap.edu.my
author_facet emcheng@unimap.edu.my
Cheng Ee, Meng
Mohd Shukry, Abdul Majid
Shahriman, Abu Bakar
Nashrul Fazli, Mohd Nasir
Khor Shing, Fhan
You Kok, Yeow
Lee Kim, Yee
Mohd Ridzuan, Mohd Jamir
format Article
author Cheng Ee, Meng
Mohd Shukry, Abdul Majid
Shahriman, Abu Bakar
Nashrul Fazli, Mohd Nasir
Khor Shing, Fhan
You Kok, Yeow
Lee Kim, Yee
Mohd Ridzuan, Mohd Jamir
author_sort Cheng Ee, Meng
title Hardened Glass Particle and Carbon Black using Resin for Potential Electromagnetic Shielding in Biomedical Electronic Equipments
title_short Hardened Glass Particle and Carbon Black using Resin for Potential Electromagnetic Shielding in Biomedical Electronic Equipments
title_full Hardened Glass Particle and Carbon Black using Resin for Potential Electromagnetic Shielding in Biomedical Electronic Equipments
title_fullStr Hardened Glass Particle and Carbon Black using Resin for Potential Electromagnetic Shielding in Biomedical Electronic Equipments
title_full_unstemmed Hardened Glass Particle and Carbon Black using Resin for Potential Electromagnetic Shielding in Biomedical Electronic Equipments
title_sort hardened glass particle and carbon black using resin for potential electromagnetic shielding in biomedical electronic equipments
publisher IOP Publishing
publishDate 2020
url http://dspace.unimap.edu.my:80/xmlui/handle/123456789/69013
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