Optimizing electroplating process parameter and Sn-Plating thickness uniformity using modified shielding

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Main Authors:	R., Izamshah, N., Suieb, M. S., Kasim, M. S., A. Aziz, M. S., Yob, S. A., Sundi, R., Zamri, R. S. A., Abdullah
Other Authors:	izamshah@utem.edu.my
Format:	Article
Language:	English
Published:	Universiti Malaysia Perlis (UniMAP) 2022
Subjects:	Electroplating Manufacturing process Physical shielding Precision engineering
Online Access:	http://dspace.unimap.edu.my:80/xmlui/handle/123456789/75798
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Institution:	Universiti Malaysia Perlis
Language:	English

id	my.unimap-75798
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spelling	my.unimap-757982022-08-07T03:30:48Z Optimizing electroplating process parameter and Sn-Plating thickness uniformity using modified shielding R., Izamshah R., Izamshah N., Suieb M. S., Kasim M. S., A. Aziz M. S., Yob S. A., Sundi R., Zamri R. S. A., Abdullah izamshah@utem.edu.my Advanced Manufacturing Centre (AMC), Universiti Teknikal Malaysia Melaka (UTeM) Faculty of Manufacturing Engineering, Universiti Teknikal Malaysia Melaka (UTeM) Fakulti Teknologi Kejuruteraan Mekanikal dan Pembuatan, Universiti Teknikal Malaysia Melaka (UTeM) School of Information Technology and Electrical Engineering, The University of Queensland Electroplating Manufacturing process Physical shielding Precision engineering Link to publisher's homepage at http://ijneam.unimap.edu.my Uneven plating thickness distribution across plated surface has become a major challenge in electroplating industry mainly due to the complexity of package design. In most cases, controlling the plating thickness uniformity to the specific area according to the required package design specification can be a challenging task for the manufacturer which can result in high losses. The plating thickness uniformity are closely related with the electroplating process parameter and the passage of current between anodes to cathode. To deal with the current passage, a shielding technique that control the disposed area between the anode and cathode can be an effective way. Therefore, the aim of this paper is to study the electroplating process parameters (current and speed) for improving the Sn-plating thickness uniformity using modified mechanical shielding. Taguchi method is adopted to reduce the size of experiment and optimize the process parameters simultaneously. As a result, new parameter has been established which offer ideal plating thickness with less variation and stable Cpk. From the conducted experimental work, it shows that by employing the right physical resistance shielding aperture able to selectively alter or modulate the electric fields between the anode and the plating surface on the embodiment and thereby control the electro deposition rate across the area of the plating surface. 2022 2022-08-07T03:30:48Z 2022-08-07T03:30:48Z 2022-03 Article International Journal of Nanoelectronics and Materials, vol.15 (Special Issue), 2022, pages 233-245 1985-5761 (Printed) 1997-4434 (Online) http://dspace.unimap.edu.my:80/xmlui/handle/123456789/75798 http://ijneam.unimap.edu.my en Special Issue ISSTE 2022; Universiti Malaysia Perlis (UniMAP)
institution	Universiti Malaysia Perlis
building	UniMAP Library
collection	Institutional Repository
continent	Asia
country	Malaysia
content_provider	Universiti Malaysia Perlis
content_source	UniMAP Library Digital Repository
url_provider	http://dspace.unimap.edu.my/
language	English
topic	Electroplating Manufacturing process Physical shielding Precision engineering
spellingShingle	Electroplating Manufacturing process Physical shielding Precision engineering R., Izamshah R., Izamshah N., Suieb M. S., Kasim M. S., A. Aziz M. S., Yob S. A., Sundi R., Zamri R. S. A., Abdullah Optimizing electroplating process parameter and Sn-Plating thickness uniformity using modified shielding
description	Link to publisher's homepage at http://ijneam.unimap.edu.my
author2	izamshah@utem.edu.my
author_facet	izamshah@utem.edu.my R., Izamshah R., Izamshah N., Suieb M. S., Kasim M. S., A. Aziz M. S., Yob S. A., Sundi R., Zamri R. S. A., Abdullah
format	Article
author	R., Izamshah R., Izamshah N., Suieb M. S., Kasim M. S., A. Aziz M. S., Yob S. A., Sundi R., Zamri R. S. A., Abdullah
author_sort	R., Izamshah
title	Optimizing electroplating process parameter and Sn-Plating thickness uniformity using modified shielding
title_short	Optimizing electroplating process parameter and Sn-Plating thickness uniformity using modified shielding
title_full	Optimizing electroplating process parameter and Sn-Plating thickness uniformity using modified shielding
title_fullStr	Optimizing electroplating process parameter and Sn-Plating thickness uniformity using modified shielding
title_full_unstemmed	Optimizing electroplating process parameter and Sn-Plating thickness uniformity using modified shielding
title_sort	optimizing electroplating process parameter and sn-plating thickness uniformity using modified shielding
publisher	Universiti Malaysia Perlis (UniMAP)
publishDate	2022
url	http://dspace.unimap.edu.my:80/xmlui/handle/123456789/75798
_version_	1743108376467865600

Optimizing electroplating process parameter and Sn-Plating thickness uniformity using modified shielding

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