Transient thermal analysis on convection process of circular plate used in hot surface deposition test rig
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Universiti Malaysia Perlis (UniMAP)
2022
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my.unimap-757992022-08-07T03:31:07Z Transient thermal analysis on convection process of circular plate used in hot surface deposition test rig M. Z., Akop F., Jikol M. Z., Akop Y. M., Arifin M. A., Salim S. G., Herawan zaid@utem.edu.my Faculty of Mechanical Engineering, Universiti Teknikal Malaysia Melaka (UTeM) Industrial Engineering Department, Faculty of Engineering, Bina Nusantara University Aluminum alloy Convection Deposits Room temperature Transient thermal Link to publisher's homepage at http://ijneam.unimap.edu.my The purpose of this study is to investigate the transient thermal behavior of the convection process of a circular-shaped aluminum alloy plate used in the Hot Surface Deposition Test (HSDT) rig. The temperature distribution and its characteristics over time are investigated by applying certain thermal load and time dependence. As the real deposition test using HSDT involves a process of detaching the aluminum alloy circular plate from the heater block, the transient thermal analysis will provide a base for estimating the time required for the hot plate to cool down to room temperature (25°C-27°C) and safe to be handled. The process of modeling the geometry, meshing, applying the boundary conditions, and evaluating results are conducted experimentally using ANSYS Release 16.2 software. It is indicated in the analysis results that the aluminum alloy circular plate with higher internal temperature undergoes a longer convection process to cool down to room temperature. These results are used to estimate the cooling down time of the hot plate in the real deposition test. 2022 2022-08-07T03:31:07Z 2022-08-07T03:31:07Z 2022-03 Article International Journal of Nanoelectronics and Materials, vol.15 (Special Issue), 2022, pages 147-157 1985-5761 (Printed) 1997-4434 (Online) http://dspace.unimap.edu.my:80/xmlui/handle/123456789/75799 http://ijneam.unimap.edu.my en Special Issue ISSTE 2022; Universiti Malaysia Perlis (UniMAP) |
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Aluminum alloy Convection Deposits Room temperature Transient thermal |
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Aluminum alloy Convection Deposits Room temperature Transient thermal M. Z., Akop F., Jikol M. Z., Akop Y. M., Arifin M. A., Salim S. G., Herawan Transient thermal analysis on convection process of circular plate used in hot surface deposition test rig |
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Link to publisher's homepage at http://ijneam.unimap.edu.my |
| author2 |
zaid@utem.edu.my |
| author_facet |
zaid@utem.edu.my M. Z., Akop F., Jikol M. Z., Akop Y. M., Arifin M. A., Salim S. G., Herawan |
| format |
Article |
| author |
M. Z., Akop F., Jikol M. Z., Akop Y. M., Arifin M. A., Salim S. G., Herawan |
| author_sort |
M. Z., Akop |
| title |
Transient thermal analysis on convection process of circular plate used in hot surface deposition test rig |
| title_short |
Transient thermal analysis on convection process of circular plate used in hot surface deposition test rig |
| title_full |
Transient thermal analysis on convection process of circular plate used in hot surface deposition test rig |
| title_fullStr |
Transient thermal analysis on convection process of circular plate used in hot surface deposition test rig |
| title_full_unstemmed |
Transient thermal analysis on convection process of circular plate used in hot surface deposition test rig |
| title_sort |
transient thermal analysis on convection process of circular plate used in hot surface deposition test rig |
| publisher |
Universiti Malaysia Perlis (UniMAP) |
| publishDate |
2022 |
| url |
http://dspace.unimap.edu.my:80/xmlui/handle/123456789/75799 |
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1743108376602083328 |