Growth of Cu-Zn5 and Cu5Zn8 intermetallic compounds in the Sn-9Zn/Cu joint during liquid state aging

Growth of Cu-Zn5 and Cu5Zn8 intermetallic compounds in the Sn-9Zn/Cu joint during liquid state aging

International Conference on X-Rays and Related Techniques in Research and Industry (ICXRI 2010) jointly organized by Universiti Malaysia Perlis (UniMAP) and X-Ray Application Malaysia Society (XAPP), 9th - 10th June 2010 at Aseania Resort Langkawi, Malaysia.

Saved in:
Bibliographic Details
Main Authors: Ramani, Mayappan, Rosyaini, A. Zaman, Zalina, Z. Abidin, Asmawati@FatinNajihah, Alias, Mohd N., Derman
Other Authors: ramani@perlis.uitm.edu.my
Format: Working Paper
Language:English
Published: Universiti Malaysia Perlis 2010
Subjects:
Cu5Zn8 Intermetallic
Lead-free Solder
Sn-Zn Solder
Energy dispersive x-ray (EDX)
International Conference on X-Rays & Related Techniques in Research & Industry (ICXRI)
Online Access:http://dspace.unimap.edu.my/xmlui/handle/123456789/9060
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: Universiti Malaysia Perlis
Language: English
Description
Summary:International Conference on X-Rays and Related Techniques in Research and Industry (ICXRI 2010) jointly organized by Universiti Malaysia Perlis (UniMAP) and X-Ray Application Malaysia Society (XAPP), 9th - 10th June 2010 at Aseania Resort Langkawi, Malaysia.

Similar Items