Growth of Cu-Zn5 and Cu5Zn8 intermetallic compounds in the Sn-9Zn/Cu joint during liquid state aging

by Ramani, Mayappan, Rosyaini, A. Zaman, Zalina, Z. Abidin, Asmawati@FatinNajihah, Alias, Mohd N., Derman
Published 2010

Microstructure evolution of Sn-3.5Ag-1.0Cu-0.5Ni/Cu system lead free solder under long term thermal aging

by Noor Asikin, Ab Ghani, Iziana, Yahya, Mohd Arif Anuar, Mohd Salleh, Saidatulakmar, Shamsuddin, Zainal Arifin, Ahmad, Ramani, Mayappan
Published 2014