Microstructure evolution of Sn-3.5Ag-1.0Cu-0.5Ni/Cu system lead free solder under long term thermal aging

Microstructure evolution of Sn-3.5Ag-1.0Cu-0.5Ni/Cu system lead free solder under long term thermal aging

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Bibliographic Details
Main Authors: Noor Asikin, Ab Ghani, Iziana, Yahya, Mohd Arif Anuar, Mohd Salleh, Saidatulakmar, Shamsuddin, Zainal Arifin, Ahmad, Ramani, Mayappan
Other Authors: asikinabghani@gmail.com
Format: Article
Language:English
Published: Scientific.Net 2014
Subjects:
Intermetallic
Powder metallurgy
Scanning electron microscope (SEM)
Sn-Ag-Cu-Ni
Thermal aging
Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/32124
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Institution: Universiti Malaysia Perlis
Language: English

Internet

http://dspace.unimap.edu.my:80/dspace/handle/123456789/32124

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