Microstructure evolution of Sn-3.5Ag-1.0Cu-0.5Ni/Cu system lead free solder under long term thermal aging

by Noor Asikin, Ab Ghani, Iziana, Yahya, Mohd Arif Anuar, Mohd Salleh, Saidatulakmar, Shamsuddin, Zainal Arifin, Ahmad, Ramani, Mayappan
Published 2014