Microstructure evolution of Sn-3.5Ag-1.0Cu-0.5Ni/Cu system lead free solder under long term thermal aging

by Noor Asikin, Ab Ghani, Iziana, Yahya, Mohd Arif Anuar, Mohd Salleh, Saidatulakmar, Shamsuddin, Zainal Arifin, Ahmad, Ramani, Mayappan
Published 2014

Characterization of Sn-3.5Ag-1.0Cu lead-free solder prepared via powder metallurgy method

by Iziana, Yahya, Noor Asikin, Ab Ghani, Mohd Arif Anuar, Mohd Salleh, Hamidi, Abd Hamid, Zainal Arifin, Ahmad, Mayappan, Ramani
Published 2013