Wafer bumping: A comparative technologies study

Wafer bumping: A comparative technologies study

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Bibliographic Details
Main Author: Mohd Khairuddin, Md Arshad
Format: Article
Language:English
Published: Universiti Malaysia Perlis (UniMAP) 2010
Subjects:
Environ > Penerbitan Universiti
UniMAP > Publications
UniMAP > Pusat Pengajian Kejuruteraan Alam Sekitar
UniMAP > Research and development
Under bump metallurgy (UBM)
Wafer bumping
Online Access:http://dspace.unimap.edu.my/xmlui/handle/123456789/9705
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Institution: Universiti Malaysia Perlis
Language: English
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