Wafer bumping: A comparative technologies study
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Universiti Malaysia Perlis (UniMAP)
2010
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| Online Access: | http://dspace.unimap.edu.my/xmlui/handle/123456789/9705 |
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| Institution: | Universiti Malaysia Perlis |
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my.unimap-97052010-10-06T02:20:10Z Wafer bumping: A comparative technologies study Mohd Khairuddin, Md Arshad Environ -- Penerbitan Universiti UniMAP -- Publications UniMAP -- Pusat Pengajian Kejuruteraan Alam Sekitar UniMAP -- Research and development Under bump metallurgy (UBM) Wafer bumping 2010-10-06T02:20:10Z 2010-10-06T02:20:10Z 2006-06 Article p.4-5 1823-9633 http://hdl.handle.net/123456789/9705 en Explore June 2006 Universiti Malaysia Perlis (UniMAP) Pejabat Timbalan Naib Canselor (Penyelidikan dan Inovasi) |
| institution |
Universiti Malaysia Perlis |
| building |
UniMAP Library |
| collection |
Institutional Repository |
| continent |
Asia |
| country |
Malaysia |
| content_provider |
Universiti Malaysia Perlis |
| content_source |
UniMAP Library Digital Repository |
| url_provider |
http://dspace.unimap.edu.my/ |
| language |
English |
| topic |
Environ -- Penerbitan Universiti UniMAP -- Publications UniMAP -- Pusat Pengajian Kejuruteraan Alam Sekitar UniMAP -- Research and development Under bump metallurgy (UBM) Wafer bumping |
| spellingShingle |
Environ -- Penerbitan Universiti UniMAP -- Publications UniMAP -- Pusat Pengajian Kejuruteraan Alam Sekitar UniMAP -- Research and development Under bump metallurgy (UBM) Wafer bumping Mohd Khairuddin, Md Arshad Wafer bumping: A comparative technologies study |
| format |
Article |
| author |
Mohd Khairuddin, Md Arshad |
| author_facet |
Mohd Khairuddin, Md Arshad |
| author_sort |
Mohd Khairuddin, Md Arshad |
| title |
Wafer bumping: A comparative technologies study |
| title_short |
Wafer bumping: A comparative technologies study |
| title_full |
Wafer bumping: A comparative technologies study |
| title_fullStr |
Wafer bumping: A comparative technologies study |
| title_full_unstemmed |
Wafer bumping: A comparative technologies study |
| title_sort |
wafer bumping: a comparative technologies study |
| publisher |
Universiti Malaysia Perlis (UniMAP) |
| publishDate |
2010 |
| url |
http://dspace.unimap.edu.my/xmlui/handle/123456789/9705 |
| _version_ |
1643789624812765184 |