Multi beam laser grooving process parameter development and die strength characterization for 40nm node low-K/ULK wafer
Ablation; Cost effectiveness; Dies; Industrial electronics; Ion beams; Laser ablation; Neodymium alloys; Neodymium lasers; Scanning electron microscopy; Semiconductor lasers; Silicon wafers; Yttrium aluminum garnet; Inspection tools; Laser frequency; Laser micro-machining; Laser process parameters;...
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| Main Authors: | , , , , |
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| Other Authors: | |
| Format: | Conference Paper |
| Published: |
Institute of Electrical and Electronics Engineers Inc.
2023
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| Institution: | Universiti Tenaga Nasional |