Single & multi beam laser grooving process parameter development and die strength characterization for 40nm node low-K/ULK wafer

by Shi K.W., Yow K.Y., Lo C.
Published 2023

Ultraviolet Laser Diode Ablation Process for CMOS 45 nm Copper Low-K Semiconductor Wafer

by Shi K.W., Kar Y.B., Talik N.A., Yew L.W.
Published 2023

Multi beam laser grooving process parameter development and die strength characterization for 40nm node low-K/ULK wafer

by Shi K.W., Yow K.Y., Lo C., Kar Y.B., Misran H.
Published 2023