In depth study of lead frame tape residuein quad flat non-leaded package
Dies; Electronics packaging; Optimization; Reinforced plastics; Semiconductor device manufacture; Design/methodology/approach; Electrical conductivity; Lead frame; Process capabilities; Semiconductor manufacturing; Thermoplastic adhesive; Viable solutions; Wire bonding; Adhesives
Saved in:
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Article |
| Published: |
Emerald Group Holdings Ltd.
2023
|
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Institution: | Universiti Tenaga Nasional |
| Summary: | Dies; Electronics packaging; Optimization; Reinforced plastics; Semiconductor device manufacture; Design/methodology/approach; Electrical conductivity; Lead frame; Process capabilities; Semiconductor manufacturing; Thermoplastic adhesive; Viable solutions; Wire bonding; Adhesives |
|---|