In depth study of lead frame tape residuein quad flat non-leaded package
Dies; Electronics packaging; Optimization; Reinforced plastics; Semiconductor device manufacture; Design/methodology/approach; Electrical conductivity; Lead frame; Process capabilities; Semiconductor manufacturing; Thermoplastic adhesive; Viable solutions; Wire bonding; Adhesives
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| Main Authors: | , |
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| Other Authors: | |
| Format: | Article |
| Published: |
Emerald Group Holdings Ltd.
2023
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| Institution: | Universiti Tenaga Nasional |