Study on reliability test of die attach material

• Main Authors: Yik L.C., Kar Y.B., Shafika N.
• Other Authors: 55787504300
• Format: Conference paper
• Published: 2023
• Subjects: copper; filler; reliability; silver; test method; Fillers; Industrial electronics; Manufacture; Reliability; Silver; Silver plating; Testing; Die attachment; Die-attach materials; Packaging companies; Reliability test; Test method; Copper
• Institution: Universiti Tenaga Nasional

Silver plated copper is a new developed die attachment material to replace pure silver. As year past, price of silver getting higher and become a problem for those semiconductors packaging company. Therefore, silver plated copper was developed as new die attachment material to solve the costing problem. But the characteristic and reliability of silver plated copper filler has be a doubt to replace the pure silver in the market. This paper will review few test method to test on the reliability of silver plated copper filler and proved that it is as good as silver to be the filler. � 2012 IEEE.