Study on reliability test of die attach material

• Main Authors: Yik L.C., Kar Y.B., Shafika N.
• Other Authors: 55787504300
• Format: Conference paper
• Published: 2023
• Subjects: copper; filler; reliability; silver; test method; Fillers; Industrial electronics; Manufacture; Reliability; Silver; Silver plating; Testing; Die attachment; Die-attach materials; Packaging companies; Reliability test; Test method; Copper
• Institution: Universiti Tenaga Nasional

Silver plated copper is a new developed die attachment material to replace pure silver. As year past, price of silver getting higher and become a problem for those semiconductors packaging company. Therefore, silver plated copper was developed as new die attachment material to solve the costing prob...