Characterization of nickel plated copper heat spreaders with different catalytic activation processes for flip-chip ball grid array package

• Main Authors: Lim V., Ahmad I., Seng F.C., Amin N., Rasid R.
• Other Authors: 26432767800
• Format: Conference Paper
• Published: 2023
• Subjects: Electronics packaging; Flip chip devices; Heating equipment; Mixed convection; Nickel; Nickel alloys; Soldering alloys; Spreaders; Thermal diffusion; Thermal diffusivity; Activation techniques; After high temperature; Catalytic activation; Copper heat spreader; Copper layer; Copper strike; Flip chip; Flip chip ball grid array; Heat spreaders; High temperature storage test; Initial time; Intermetallic diffusion; Intermetallic layer; Pure copper; Semiconductor packages; Thermal Performance; Copper
• Institution: Universiti Tenaga Nasional

This paper presents the effects of two different catalytic activation techniques on the thermal performance of flip chip heat spreaders. The two activation techniques investigated are i) thin nickel-copper strike and ii) galvanic initiation. Thermal diffusivity of these heat spreaders was studied us...