Characterization of nickel plated copper heat spreaders with different catalytic activation processes for flip-chip ball grid array package

by Lim, V., Ahmad, I., Seng, F.C., Amin, N., Rasid, R.
Published 2017

Characterization of nickel plated copper heat spreaders with different catalytic activation processes for flip-chip ball grid array package

by Lim V., Ahmad I., Seng F.C., Amin N., Rasid R.
Published 2023

Microgrids: A Model for Basic Microsurgery Skills Training

by Gunasagaran, Jayaletchumi, Rasid, R.J., Mappiare, Sahrinanah, Devarajooh, Cassidy, Ahmad, Tunku Sara
Published 2018

Effects of different catalytic activation techniques on the thermal performance of flip chip heat spreader

by Lim, V., Amin, N., Foong, C.S., Ahmad, I., Zaharim, A., Rasid, R., Jalar, A.
Published 2017