Surface morphology study on aluminum alloy after treated with silicate-based corrosion inhibitor from paddy residue

by Mohamad, N., Jalar, A., Othman, N.K.
Published 2014

The effect of number of zincation in Electroless Nickel Immersion Gold (ENIG) Under Bump Metallurgy (UBM) on reliability in microelectronics packaging

by Abdullah, S.H., Ahmad, I., Jalar, A.
Published 2017

Characterization of parasitic residual deposition on passivation layer in electroless nickel immersion gold process

by Md Arshad, M.K., Jalar, A., Ahmad, I.
Published 2017

Surface morphology studies of low carbon steel treated in aqueous lignin

by Yahya, S., Othman, N.K., Daud, A.R., Jalar, A.
Published 2013

A comparison study of SAC405 and SAC387 lead-free solder ball alloy characteristic and solder joint system on Ni/Au finish

by Leng, E.P., Ding, M., Ahmad, I., Jalar, A.
Published 2017

Dicing die attach film for 3D stacked die QFN packages

by Abdullah, S., Mohd Yusof, S., Ahmad, I., Jalar, A., Daud, R.
Published 2017

Effect of wafer thinning methods towards fracture strength and topography of silicon die

by Jiun, H.H., Ahmad, I., Jalar, A., Omar, G.
Published 2017

Effect of laminated wafer toward dicing process and alternative double pass sawing method to reduce chipping

by Jiun, H.H., Ahmad, I., Jalar, A., Omar, G.
Published 2017

Microstructure study of lead free solders in electroless nickel gold under bump metallurgy solder bump

by Salleh, M.M., Ahmad, I., Jalar, A., Omar, G.
Published 2017

Alternative double pass dicing method for thin wafer laminated with die attach film

by Jiun, H.H., Ahmad, I., Jalar, A., Omar, G.
Published 2017

Dicing laminated wafer for QFN 3D stacked die packaging

by Abdullah, S., Endut, Z., Ahmad, I., Jalar, A., Yusof, S.M.
Published 2017

Optimization of nickel thickness on substrate for TBGA using SAC387 solder material

by Ahmad, I., Majlis, B.Y., Jalar, A., Leng, E.P.
Published 2017

The characterization of Al bond pad surface treatment in electroless nickel immersion gold (ENIG) deposition

by Md Arshad, M.K., Jalar, A., Ahmad, I., Omar, G.
Published 2017

The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition

by Arshad, M.K.M., Ahmad, I., Jalar, A., Omar, G.
Published 2017

The effects of zincation process on aluminum bond pad surfaces for Electroless Nickel Immersion Gold (ENIG) deposition

by Md Arshad, M.K., Ahmad, I., Jalar, A., Omar, G.
Published 2017

Effect of treated silver nanoparticles to electrical conductivity improvement of electrically conductive adhesive (ECA)

by Kornain, Z., Amin, N., Jalar, A., Cheah, A.Y., Ahmad, I.
Published 2017

Effect of treated silver nanoparticles to electrical conductivity improvement of electrically conductive adhesive (ECA)

by Kornain Z., Amin N., Jalar A., Cheah A.Y., Ahmad I.
Published 2023

Pb-free BGA solder joint reliability improvement with Sn3.5Ag solder alloy on Ni/Au finish

by Leng, E.P., Ding, M., Lindsay, W., Chopin, S., Ahmad, I., Jalar, A.
Published 2017

Solder joint strength of lead free solders under multiple reflow and high temperature storage condition

by Ahmad, I., Jalar, A., Majlis, B.Y., Leng, E.P., San, Y.S.
Published 2017

Effect of reflow profile (RSP Vs RTP) On Su/3.8Ag/0.7Cu solder joint strength

by Eu, P.-L., Ahmad, I., Jalar, A., Kamarudin, H., Majlis, B.Y.
Published 2017