The effect of number of zincation in Electroless Nickel Immersion Gold (ENIG) Under Bump Metallurgy (UBM) on reliability in microelectronics packaging
This paper discusses on the effect of number of zincation in Electroless Nickel Immersion Gold (ENIG) Under Bump Metallurgy (UBM) on reliability in microelectronics packaging. Double and triple Zincation of ENIG methods were used as comparison study. The effect of number of zincation to surface roug...
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| Main Authors: | , , |
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| Published: |
2017
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| Online Access: | http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5307 |
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| Institution: | Universiti Tenaga Nasional |