Optimization of nickel thickness on substrate for TBGA using SAC387 solder material
The purpose of this paper is to discuss the effect of Nickel (Ni) thickness on lead free solder joint material for tape ball grid array (TBGA) application. In this study, four different level of Nickel thickness were chose that is 3um, 4um, 5um and 6 um. Ball pull testing was used to assess the sold...
Saved in:
| Main Authors: | , , , |
|---|---|
| Format: | |
| Published: |
2017
|
| Online Access: | http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5287 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Institution: | Universiti Tenaga Nasional |