Effect of treated silver nanoparticles to electrical conductivity improvement of electrically conductive adhesive (ECA)
Electrically conductive adhesive (ECA) is a popular alternative to replace lead solder interconnect material in most areas of electronic packaging. ECA mainly consists of an organic/polymeric binder matrix and metal filler. These composite materials provide both physical adhesion and electrical cond...
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Main Authors: | , , , , |
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2017
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Online Access: | http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5277 |
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Institution: | Universiti Tenaga Nasional |