The effect of clean and no-clean flux in enhancing the wettability of eutectic solder bump flip chip PBGA

• Main Authors: Amin N., Cheah A.Y., Kornain Z., Ahmad I.
• Other Authors: 7102424614
• Format: Conference paper
• Published: 2023
• Subjects: Brazing; Dies; Electronics packaging; Eutectics; Lead; Melting point; Welding; Comparative studies; Eutectic solders; Experimental studies; Flip chip dies; Flip chip PBGA; High Lead Solder; Silicon die; Thermal gravimetric analyzer; Weight loss; Soldering alloys
• Institution: Universiti Tenaga Nasional

Five different types of clean flux and no-clean flux, which are mainly used in flip chip die attach, have been analyzed in respect to the wettability of eutectic solder bump in flip chip PBGA. An experimental study is carried out to measure the spreading area of the eutectic solder bump processed wi...