Analysis of Transmission Performance for Fine Pitch Interconnect

• Main Authors: Leong H.Y., Yap B.K., Chin L.P., Zuraida E.E., Awang Mat Z.
• Other Authors: 55787052600
• Format: Book chapter
• Published: Trans Tech Publications Ltd 2024
• Subjects: electrical performance; fine pitch interconnect; insulated Cu wire; signal transmission
• Institution: Universiti Tenaga Nasional

Wire bonding is the preferred interconnection in the IC packaging. Understanding the electrical performance of bonding wire as transmission line is utmost important. To date, there are very limited studies on the transmission performance of fine pitch bare bonding wire especially the insulated wires...