A comparison study of SAC405 and SAC387 lead-free solder ball alloy characteristic and solder joint system on Ni/Au finish
In this study, two Sn-Ag-Cu alloys, namely SAC405 & SAC387 were compared in terms of the following characteristics: solder ball surface morphology, solder ball surface cleanliness through Auger elemental depth profile analysis, ball shear strength (at time zero, after test, after multiple reflow...
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| Main Authors: | , , , |
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| Format: | |
| Published: |
2017
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| Online Access: | http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5285 |
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| Institution: | Universiti Tenaga Nasional |
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