Effect of moisture on underfill interfacial adhesion and packages flexural strength in flip chip packaging
In this study, effect of various moisture condition on underfill interfacial adhesion loss were examined using C-SAM, 4-point flexural bend test, and cross sectional analysis. In addition, weight gain analysis was used to determine packages moisture absorption at preconditioning level. In order to u...
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| Main Authors: | , , , |
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| Format: | |
| Published: |
2017
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| Online Access: | http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5306 |
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| Institution: | Universiti Tenaga Nasional |