Interfacial reaction analysis of Sn-Ag-Cu solder reinforced with 0.01wt% CNTs with isothermal aging

Interfacial reaction analysis of Sn-Ag-Cu solder reinforced with 0.01wt% CNTs with isothermal aging

This study focused on the formation and growth of intermetallic compound (IMC) layer at the interfaces of pad finishes. The thickness of IMC layer, wetting angle, and defects such as floating IMC and voids formation after as reflow and isothermal aging were discussed. In this study, SAC237 (Sn: 99 w...

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Bibliographic Details
Main Authors: Mohamed Ariff, Azmah Hanim, M. N., Mohamad Aznan, R., Muhammad Raimi, A., Muhammad Azrol Amin
Format: Article
Language:English
Published: Trans Tech Publications 2016
Online Access:http://psasir.upm.edu.my/id/eprint/54598/1/Interfacial%20reaction%20analysis%20of%20Sn-Ag-Cu%20solder%20reinforced%20with%200.01wt%25%20CNTs%20with%20isothermal%20aging.pdf
http://psasir.upm.edu.my/id/eprint/54598/
https://www.scientific.net/MSF.864.175
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Institution: Universiti Putra Malaysia
Language: English

Internet

http://psasir.upm.edu.my/id/eprint/54598/1/Interfacial%20reaction%20analysis%20of%20Sn-Ag-Cu%20solder%20reinforced%20with%200.01wt%25%20CNTs%20with%20isothermal%20aging.pdf
http://psasir.upm.edu.my/id/eprint/54598/
https://www.scientific.net/MSF.864.175

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