Interfacial reaction analysis of Sn-Ag-Cu solder reinforced with 0.01wt% CNTs with isothermal aging

• Main Authors: Mohamed Ariff, Azmah Hanim, M. N., Mohamad Aznan, R., Muhammad Raimi, A., Muhammad Azrol Amin
• Format: Article
• Language: English
• Published: Trans Tech Publications 2016
• Online Access: http://psasir.upm.edu.my/id/eprint/54598/1/Interfacial%20reaction%20analysis%20of%20Sn-Ag-Cu%20solder%20reinforced%20with%200.01wt%25%20CNTs%20with%20isothermal%20aging.pdf; http://psasir.upm.edu.my/id/eprint/54598/; https://www.scientific.net/MSF.864.175
• Institution: Universiti Putra Malaysia

This study focused on the formation and growth of intermetallic compound (IMC) layer at the interfaces of pad finishes. The thickness of IMC layer, wetting angle, and defects such as floating IMC and voids formation after as reflow and isothermal aging were discussed. In this study, SAC237 (Sn: 99 w...