Intermetallic growth of SAC237 solder paste reinforced with MWCNT

• Main Authors: Mohamed Ariff, Azmah Hanim, Mohd Najib, Mohamad Aznan, Roslan, Muhammad Raimi, Anuar, Muhammad Azrol Amin
• Format: Article
• Language: English
• Published: Universiti Putra Malaysia Press 2017
• Online Access: http://psasir.upm.edu.my/id/eprint/58326/1/16%20JST%28S%29-0284-2017-2ndProof.pdf; http://psasir.upm.edu.my/id/eprint/58326/; http://www.pertanika.upm.edu.my/Pertanika%20PAPERS/JST%20Vol.%2025%20(4)%20Oct.%202017/16%20JST(S)-0284-2017-2ndProof.pdf
• Institution: Universiti Putra Malaysia

The formation of intermetallic compound (IMC) layer at the interfaces of pad finishes has been studied. The growth of IMC layer as a reflow process and its properties were also discussed. In this study, solder alloy SAC237 (Sn: 99 wt.%, Ag: 0.3 wt.%, Cu: 0.7 wt.%), reinforced with 0.01 wt.% Multi-Wa...