A Study On Mechanical Behaviour Of Lead-Free Solder Using Nanoindentation Test

A Study On Mechanical Behaviour Of Lead-Free Solder Using Nanoindentation Test

As the usage of lead components has been limited by Europe Union, replacement Sn-Ag-Cu is investigated and practiced in the electronic manufacturing field. Due to constant push for miniaturization in the electronic package, the strength of solder joint of the electronic component on circuit board is...

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Bibliographic Details
Main Author: Ong, Mei Kiem
Format: Monograph
Language:English
Published: Universiti Sains Malaysia 2018
Subjects:
T Technology
TJ Mechanical engineering and machinery
Online Access:http://eprints.usm.my/54112/1/A%20Study%20On%20Mechanical%20Behaviour%20Of%20Lead-Free%20Solder%20Using%20Nanoindentation%20Test_Ong%20Mei%20Kiem_M4_2018.pdf
http://eprints.usm.my/54112/
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Institution: Universiti Sains Malaysia
Language: English

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http://eprints.usm.my/54112/1/A%20Study%20On%20Mechanical%20Behaviour%20Of%20Lead-Free%20Solder%20Using%20Nanoindentation%20Test_Ong%20Mei%20Kiem_M4_2018.pdf
http://eprints.usm.my/54112/

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