A Study On Mechanical Behaviour Of Lead-Free Solder Using Nanoindentation Test
As the usage of lead components has been limited by Europe Union, replacement Sn-Ag-Cu is investigated and practiced in the electronic manufacturing field. Due to constant push for miniaturization in the electronic package, the strength of solder joint of the electronic component on circuit board is...
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| Main Author: | |
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| Format: | Monograph |
| Language: | English |
| Published: |
Universiti Sains Malaysia
2018
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| Online Access: | http://eprints.usm.my/54112/1/A%20Study%20On%20Mechanical%20Behaviour%20Of%20Lead-Free%20Solder%20Using%20Nanoindentation%20Test_Ong%20Mei%20Kiem_M4_2018.pdf http://eprints.usm.my/54112/ |
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| Institution: | Universiti Sains Malaysia |
| Language: | English |