Finite Element Analysis Of Bending Delamination In Multilayer Circuit Boards PCBs
For decades, multilayer circuit boards have been often used in the electronic industry, and their application in electronic devices has been crucial and rising in recent years. It has the advantages of mobility, weight, and flexibility. Although the analysis of delamination bending has long existe...
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| Format: | Monograph |
| Language: | English |
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Universiti Sains Malaysia
2022
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| Online Access: | http://eprints.usm.my/55972/1/Finite%20Element%20Analysis%20Of%20Bending%20Delamination%20In%20Multilayer%20Circuit%20Boards%20Pcbs_Ahmad%20Fazlullah%20Zulkifli.pdf http://eprints.usm.my/55972/ |
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| Institution: | Universiti Sains Malaysia |
| Language: | English |