Finite Element Analysis Of Bending Delamination In Multilayer Circuit Boards PCBs

• Main Author: Zulkifli, Ahmad Fazlullah
• Format: Monograph
• Language: English
• Published: Universiti Sains Malaysia 2022
• Subjects: T Technology; TJ Mechanical engineering and machinery
• Online Access: http://eprints.usm.my/55972/1/Finite%20Element%20Analysis%20Of%20Bending%20Delamination%20In%20Multilayer%20Circuit%20Boards%20Pcbs_Ahmad%20Fazlullah%20Zulkifli.pdf; http://eprints.usm.my/55972/
• Institution: Universiti Sains Malaysia

For decades, multilayer circuit boards have been often used in the electronic industry, and their application in electronic devices has been crucial and rising in recent years. It has the advantages of mobility, weight, and flexibility. Although the analysis of delamination bending has long existe...