Electrical, morphological and surface roughness analysis of silver nanoparticles-filled epoxy conductive ink
Conductive ink has become a potential alternative to replace the conventional circuitry in electronic applications. Due to this, various efforts have been conducted to obtain the optimum ink formulation that can fulfill the current demand. The objective of this study is to determine the performance...
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| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Science and Technology Research Institute for Defence
2021
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| Online Access: | http://eprints.utem.edu.my/id/eprint/25788/2/ELECTRICAL%2C%20MORPHOLOGICAL%20AND%20SURFACE%20ROUGHNESS%20ANALYSIS%20OF%20SILVER%20NANOPARTICLES-FILLED%20EPOXY%20CONDUCTIVE%20INK.PDF http://eprints.utem.edu.my/id/eprint/25788/ https://www.stride.gov.my/v3/images/buletin-teknikal/2021_vol_14_num_2.pdf |
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| Institution: | Universiti Teknikal Malaysia Melaka |
| Language: | English |