Electrical, morphological and surface roughness analysis of silver nanoparticles-filled epoxy conductive ink

• Main Authors: Salim, Mohd Azli, Md. Saad, Adzni, Ahmad, Fauzi, Hamidi, Roshidah, Ali, Murni, Dai, Feng
• Format: Article
• Language: English
• Published: Science and Technology Research Institute for Defence 2021
• Online Access: http://eprints.utem.edu.my/id/eprint/25788/2/ELECTRICAL%2C%20MORPHOLOGICAL%20AND%20SURFACE%20ROUGHNESS%20ANALYSIS%20OF%20SILVER%20NANOPARTICLES-FILLED%20EPOXY%20CONDUCTIVE%20INK.PDF; http://eprints.utem.edu.my/id/eprint/25788/; https://www.stride.gov.my/v3/images/buletin-teknikal/2021_vol_14_num_2.pdf
• Institution: Universiti Teknikal Malaysia Melaka

Conductive ink has become a potential alternative to replace the conventional circuitry in electronic applications. Due to this, various efforts have been conducted to obtain the optimum ink formulation that can fulfill the current demand. The objective of this study is to determine the performance...