Stress intensity factors for thermoelectric bonded materials weakened by an inclined crack

Stress intensity factors for thermoelectric bonded materials weakened by an inclined crack

Thermoelectric Bonded Materials (TEBM) weakened by an Inclined Crack Problems (ICP) subjected to remote stress was presented in this study. The problems are addressed by employing the Modified Complex Variable Function (MCVF) method, which incorporates the Continuity Conditions (CC) for the Resultan...

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Main Authors: Hamzah, Khairum, Waini, Iskandar, Mohd Nordin, Muhammad Haziq Iqmal, Nik Long, Nik Mohd Asri, Sayed Nordin, Sayed Kushairi, Khashi’ie, Najiyah Safwa, Zainal, Nurul Amira
Format: Article
Language:English
Published: Semarak Ilmu Publishing 2024
Online Access:http://eprints.utem.edu.my/id/eprint/27245/2/0215325012024131630693.PDF
http://eprints.utem.edu.my/id/eprint/27245/
https://semarakilmu.com.my/journals/index.php/appl_mech/article/view/4373/3597
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Institution: Universiti Teknikal Malaysia Melaka
Language: English

Internet

http://eprints.utem.edu.my/id/eprint/27245/2/0215325012024131630693.PDF
http://eprints.utem.edu.my/id/eprint/27245/
https://semarakilmu.com.my/journals/index.php/appl_mech/article/view/4373/3597

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