Stress intensity factors for thermoelectric bonded materials weakened by an inclined crack

• Main Authors: Hamzah, Khairum, Waini, Iskandar, Mohd Nordin, Muhammad Haziq Iqmal, Nik Long, Nik Mohd Asri, Sayed Nordin, Sayed Kushairi, Khashi’ie, Najiyah Safwa, Zainal, Nurul Amira
• Format: Article
• Language: English
• Published: Semarak Ilmu Publishing 2024
• Online Access: http://eprints.utem.edu.my/id/eprint/27245/2/0215325012024131630693.PDF; http://eprints.utem.edu.my/id/eprint/27245/; https://semarakilmu.com.my/journals/index.php/appl_mech/article/view/4373/3597
• Institution: Universiti Teknikal Malaysia Melaka

Thermoelectric Bonded Materials (TEBM) weakened by an Inclined Crack Problems (ICP) subjected to remote stress was presented in this study. The problems are addressed by employing the Modified Complex Variable Function (MCVF) method, which incorporates the Continuity Conditions (CC) for the Resultan...