Interfacial reaction between SAC305 lead–free solders and ENImAg surface finish and bare copper
Different surface finishes on printed circuit board strongly influence the formation of intermetallic compounds (IMCs), and solder joint reliability. In this paper the effect of two different substrates namely electroless nickel/immersion silver (ENImAg) and bare copper on interfacial reaction when...
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| Main Authors: | , |
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| Format: | Article |
| Published: |
Wiley
2017
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| Subjects: | |
| Online Access: | http://eprints.uthm.edu.my/5604/ |
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| Institution: | Universiti Tun Hussein Onn Malaysia |